gEDA-user: Problem breaking apart an element in the buffer

Peter Clifton pcjc2 at
Sun Sep 28 13:49:07 EDT 2008

On Sun, 2008-09-28 at 13:08 -0400, tj wrote:
> In my continuing learning experience with creating/modifying  footprints 
> I have run into the following problem. Using the inputs form several 
> other users I created my first footprint, a 16 pin DIP with oval pads 
> (thanks to all). Then I wanted to create 8, 14, 18, etc pins footprints. 
> I selected my 16 pin footprint into the buffer and selected the "break 
> buffer elements to pieces" like the manual said. I ended up with my 
> original vias (pins), component side lines (pads) and silk screen, but 
> NO solder side lines (pads). Why did the solder side disappear when 
> executing the "break buffer elements to pieces" command?

That probably isn't intended.

Could you open a bug in PCB's bug tracker:

Best wishes,

Peter Clifton

Electrical Engineering Division,
Engineering Department,
University of Cambridge,
9, JJ Thomson Avenue,

Tel: +44 (0)7729 980173 - (No signal in the lab!)

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