gEDA-user: PCB paste layer, revisited.

[Chris Albertson]

I think the "correct" way to do this is for the file to hold information
that exactly describes the solder paste.  You need the three dimensional
shape.  Plan view and thickness.

How to cut a stencil so as to get the above is not part of the layout but
part of the "process".

I see two steps.  (1) create the solder past specs based whatever
information may be available and helpful The abount oand shape of the paste
depends on the part and the
size of the pad.  A user could specify some rules but reasonable default
rules should be built in.  Just using the pad size is a rather crude rules
but a decent start.  (2) The sticil is made based on the shape and volume of
the paste.  There should be rules that translate past size/volume to stencil
shape and again the user can change some parameters

The bottom line is that pad != paste != stencil.  The relationships are
dependent on the process
-- 
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Chris Albertson
Redondo Beach, California
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