gEDA-user: Footprint with Unusual Pads

[John Luciani]

On 15 Dec 2006 13:39:04 +0100, David Kuehling <dvdkhlng at gmx.de> wrote:
> Hi,
>
> Looking at the PCB docs it seems like SMD pads must either be round or
> rectangular, never both?  I'm just looking at the recommended land
> pattern in this data sheet (PDF, page before last page):
>
> http://www.ti.com/lit/gpn/bq24070
>
> They'r drawing longish pads which are round on one end and rectangular
> at the other end.
>
> Also the die-attach pad has a very unusual complex polygonal form.
>
> What's the right way to define such a footprint (preferably
> oldlib-style)?  Add some additional copper polygons around the pad??  Or
> overlap multiple pads with the same name/number?  Or just make all pads
> rectangular and hope that reflow soldering still works?

Multiple pads (with the same the pin number) should work. Each pin would take
two pads, the die-attach would take four pads.

(* jcl *)


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