Re: gEDA-user: pcb flip-sides

[Peter Clifton <pcjc2@xxxxxxxxx>]

On Thu, 2009-10-29 at 19:52 -0400, DJ Delorie wrote:
> In the photo you included, the physical stackup would be:
> 
> component
> solder
> outline
> GND
> power
> signal1
> signal2
> signal3
> 
> Note that the lesstif HID uses the same type of layout grid.
> 
> If you're iterating from 0..max_layers, just use it as the array index
> into PCB->LayerGroups.Entries[].  The only catch is, if the component
> group is *after* the solder group in the list, you iterate backwards.

Just looking at that.. by a definition you mentioned once before..
should it in fact be that the above board has physical stackup:

component
solder

(other layers are outside the physical stack)

?



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