> 1- Add buried/blind vias
That would require a file format change. Please discuss the new
format with us before you start, as that's likely to affect your
changes. There's also been a little discussion about being able to
set pad/via annulus sizes and clearances separately for inner, top,
and bottom layers. It might be a natural thing to combine that with
blind/buried via support.
Plus, you might want to wait a week or so, we're just about to start
migrating the HID project into the official CVS repository; most of
the code will change and you wouldn't want to have to redo your work.
> 2- on a relatively longer term basis, will try to make a
> translator or inteface to opensource tools for EMI, transmission
> line and delays analysis (such as MMTL, wcalc, GLMoM for EM
> analysis,...). We are trying to design a desktop & mobile
> motherboard using PCB (for commercial use), and we will see if can
> adapt any missing functions as we proceed.
Might want to use HID exporters for these.
> We have used before major PCB tools from the leading companies,
> and I think PCB is a piece of cake when it comes to ease of use,
> and I believe its source cose is relatively easy to follow
> (compared to other EDA codes I have seen!)
And HID is supposed to make it *easier* to follow :-)
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