Re: gEDA: changes for buried vias

[DJ Delorie <dj@xxxxxxxxxxx>]

>   1- Add buried/blind vias

That would require a file format change.  Please discuss the new
format with us before you start, as that's likely to affect your
changes.  There's also been a little discussion about being able to
set pad/via annulus sizes and clearances separately for inner, top,
and bottom layers.  It might be a natural thing to combine that with
blind/buried via support.

Plus, you might want to wait a week or so, we're just about to start
migrating the HID project into the official CVS repository; most of
the code will change and you wouldn't want to have to redo your work.

>   2- on a relatively longer term basis, will try to make a
>   translator or inteface to opensource tools for EMI, transmission
>   line and delays analysis (such as MMTL, wcalc, GLMoM for EM
>   analysis,...).  We are trying to design a desktop & mobile
>   motherboard using PCB (for commercial use), and we will see if can
>   adapt any missing functions as we proceed.

Might want to use HID exporters for these.

>   We have used before major PCB tools from the leading companies,
>   and I think PCB is a piece of cake when it comes to ease of use,
>   and I believe its source cose is relatively easy to follow
>   (compared to other EDA codes I have seen!)

And HID is supposed to make it *easier* to follow :-)