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Re: gEDA-dev: [pcb] thin lines for assembly layer?



DJ Delorie wrote:
For one of my recent footprints, I added an 0.01 mil silk where the
physical part was, so I could verify the pads and such.  It got me to
thinking, maybe we could special-case "thin" silk to be used for the
assembly drawing?  I.e. if silk is <0.1mil, it's not drawn on the
regular silk print, but is drawn on the assembly print.  For the GUI,
it's drawn just like it is now.

I'd rather have a special layer just for assembly, but that means
adding to the Element file format and major changes to pcb to support
it all.  The thin-silk change is a hack, but a small hack and no file
format changes are required.

Thoughts?  Should we wait until the hard "more layer types" change is
made, or add the hack now?

Even though I'd generally rather not do such hacks, having very think silk on the screen that doesn't go into the silk gerber file could be most useful right now. I don't think I have a problem with it. Maybe the biggest issue is how to handle DRC. Right now DRC will complain loudly. We could easily make it not complain about <0.1 mil silk but then it might not catch a real mistake.


How much work do you think it really would be to allow ElementLine and ElementArc to have a flag which specifies a layer and to support multiple annotation layers this way?

-Dan


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