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Re: gEDA: Problems with connection scanning



On Sun, Aug 08, 2004 at 02:27:45PM +0000, Karel Kulhav? wrote:
> > > Sometimes these pieces were thinner than minimum width etc.
> > > 
> > > They said these small triangles can peel off, float in the bath and stick
> > > somewhere else and cause a short-circuit. So I broke the polygons on each
> > > such a tiny piece and replaced with several smaller polygons that didn't
> > > cover the area the tiny piece existed.
> > 
> > ah.  I know what you mean.  PCB currently does not perform any
> > "island removal".  Some commercial tools have a feature where you can specify
> > a minimum copper area for any polygon.  If after a copper pour, there are any
> > small isolated area with an area less than the threshold, they are removed.
> 
> This is of no use. The islands are often big with problematic whiskers etc.
> What would be more interesting would be to specify more general logical
> function dependent on whether the island is connected somewhere , what is
> it's minimum/maximum width etc.

This is probably somewhat a result of the technique used by PCB.  PCB basically
punches holes in a polygon.  What some other tools do is to use a circular
aperture, say 10 mils, and draw in the fill.  That technique has the advantage
of never creating "whiskers" in the first place.  A very bare bones algorithm is
basically do a scan across the board and turn on the aperture whenever doing so
would a) produce copper inside the fill area and b) not cause a DRC violation or
short.  The refinement which probably takes a lot more work is to follow up 
that scan step with something which traces the outline of all the filled areas
with the fill aperture to clean up the bumpy edges you get from the first step.
I don't think you have to implement a fill this way to get the same effect though.
I'd love to see PCB have something which cleaned up some of this stuff.  Another
area I see is if you have a pin/via with a thermal which is close to a polygon edge. 
Its pretty easy to end up with something ugly.

> For example some board have tons of tiny squares that are not connected
> together to perform coverage equalization, copper savings etc. My manufacturer
> didn't want any such thing. It's probably necessary only in very big series or
> in some extra cheapo processes or I don't know what. I can see it on PCI cards.

I've often times placed a pattern of 0.040" square pads on a 0.050" grid in 
unused area on a board.  It can be quite useful on a prototype board when
you decide you need just one extra circuit that wasn't part of the original
design...

-Dan


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