[Date Prev][Date Next][Thread Prev][Thread Next][Date Index][Thread Index]
Re: gEDA: possible change, feedback desired
- To: geda-dev@seul.org, t_porter@dingoblue.net.au
- Subject: Re: gEDA: possible change, feedback desired
- From: Magnus Danielson <cfmd@swipnet.se>
- Date: Mon, 06 Aug 2001 23:38:47 +0200
- Delivery-Date: Mon, 06 Aug 2001 17:15:22 -0400
- In-Reply-To: <20010727004352.0eed28bd.t_porter@dingoblue.net.au>
- References: <20010726180926.6e70a9d4.t_porter@dingoblue.net.au><3B6028AF.8455172@acuson.com><20010727004352.0eed28bd.t_porter@dingoblue.net.au>
- Reply-To: geda-dev@seul.org
- Sender: owner-geda-dev@seul.org
From: Terry Porter <t_porter@dingoblue.net.au>
Subject: Re: gEDA: possible change, feedback desired
Date: Fri, 27 Jul 2001 00:43:52 -0500
> On Thu, 26 Jul 2001 07:26:55 -0700
> Rick Munden <munden@acuson.com> wrote:
>
> > Terry Porter wrote:
> > >
> > > On Thu, 26 Jul 2001 09:01:49 +0100
> > > "Paul Robertson" <Paul.Robertson@dgw.co.uk> wrote:
> > >
> > > > At the risk of sounding sci-fi, may I suggest that we don't limit ourselves
> > > > to only placing components on the top and bottom faces of the board? It may
> > > > be a number of years before burying components within a board becomes
> > > > mainstream, but it never hurts to be forward-looking, eg.
> > > >
> > > > COMPONENT capacitor 33p comp_layer=2
> > >
> > > I'd hate to have to repair one ;-)
> > >
> > > Actually you may be just a little too far in the future, and having a attribute that wont be used for quite some time, will only add to the overhead.
> > >
> > > Allowing for it to be used, when the technology is ready, would be a good idea though ?
> > >
> > > --
> > > Kind Regards
> > > Terry
> >
> > If it is just an attribute, it should be allowed by default. BTW,
> > people have been building boards with embedded termination resistors for
> > some years.
> >
> > Rick Munden
>
> This is an interesting concept, if the resistor is in fact a micro
> melf, located in an unplated thru-hole, which layer *is* this
> component located on ?
This is a valid question and just shows that if you want to be generic
it can hurt your brain until you have come up with the "obvious"
solution.
The attachment points will be at the same planar (XY) position but
only differ in Z led. This should not by itself be unique to these
MELF components in this arrangements. There are card-edge contacts and
other similar arrangements having the same property.
However, there is also components indeed BURRIED into the PCB like
resistors and capacitors and this is becoming hype in the highdensity
cases such as cellular phones.
Cheers,
Magnus